DocumentCode
2669822
Title
Reliability issues in AlGaN based deep ultraviolet light emitting diodes
Author
Khan, Asif ; Hwang, Seongmo ; Lowder, Jonathan ; Adivarahan, Vinod ; Fareed, Qhalid
Author_Institution
Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC, USA
fYear
2009
fDate
26-30 April 2009
Firstpage
89
Lastpage
93
Abstract
AlGaN based deep ultraviolet light emitting diodes (DUV LEDs) are key components in systems for air, water, and food purification and germicidal applications. Because of the heteroepitaxial growth of the DUV LED epilayers on sapphire, they have a large number of dislocations that invariably leads to a reduction of quantum efficiency and lifetime degradation. In this paper, we present our recent work at developing DUV LEDs with different device geometries, which includes a new micro-pixel electrode arrangement. This arrangement was used to study mechanisms responsible for their degradation. The micro-pixel device geometry with some new packaging schemes led to DUV LEDs with emission at 280 nm and lifetimes well in excess of 3000 hours. In this paper experimental details and the results of our study are presented.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; light emitting diodes; sapphire; semiconductor device packaging; semiconductor device reliability; semiconductor epitaxial layers; semiconductor growth; Al2O3; AlGaN-Al2O3; DUV LED reliability; air purification; deep ultraviolet light emitting diode; dislocation; food purification; germicidal applications; heteroepitaxial growth; lifetime degradation; micropixel device geometry; micropixel electrode arrangement; packaging scheme; quantum efficiency reduction; sapphire; water purification; wavelength 280 nm; Aluminum gallium nitride; Buffer layers; Geometry; Light emitting diodes; Purification; Quantum well devices; Substrates; Temperature; Thermal conductivity; Thermal degradation; UV-LEDs; hetero-epitaxy; lifetime degradation; micro-pixel;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2009 IEEE International
Conference_Location
Montreal, QC
ISSN
1541-7026
Print_ISBN
978-1-4244-2888-5
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2009.5173229
Filename
5173229
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