• DocumentCode
    2669884
  • Title

    Reliability and lifetime of flexible organic electronics

  • Author

    Kreger, Michael ; Ziera, E. ; Eckert, B. ; Lee, Sang-Rim ; Pusateri, B. ; Wicks, S. ; Rodman, S. ; Hauch, J. ; Brabec, C.

  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    104
  • Lastpage
    104
  • Abstract
    In this paper we will define reliability testing for organic thin film flexible photovoltaics. We will give examples of accelerated lifetime testing (ALT) protocols designed to quantify materials with respect to product specification and to meet customer needs. We will show the correlation between various standardized accelerated testing conditions and discuss progress in packaging. We find examples of ALT used in the solar industry and organic light emitting display technology and discuss how those might be structured to address the uniqueness of flexible electronics. With the standard being set by glass, some of the standard ALT might be modified to provide a meaningful evaluation of flex. In conclusion, we will present and discuss some common failure mechanisms, show evidence of degradation within the package and explore how this compromises photovoltaic performance.
  • Keywords
    failure analysis; flexible electronics; life testing; organic semiconductors; photoelectric devices; semiconductor device packaging; semiconductor device reliability; semiconductor device testing; thin film devices; accelerated lifetime testing; electronic packaging; failure mechanism; flexible organic electronics; organic thin film flexible photovoltaics; reliability testing; Displays; Electronics industry; Electronics packaging; Life estimation; Life testing; Materials testing; Organic electronics; Photovoltaic cells; Protocols; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173232
  • Filename
    5173232