DocumentCode
2669945
Title
Silicon nanofabrication technologies for compact integrated receivers working at THz frequencies
Author
Jung, C. ; Lee, C. ; Chattopadhyay, G. ; Siles, J. ; Reck, T. ; Lin, R. ; Cooper, K. ; Mehdi, I.
Author_Institution
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear
2011
fDate
2-7 Oct. 2011
Firstpage
1
Lastpage
2
Abstract
Silicon nanofabrication technologies provide precise dimensional control and batch processing capability. These features have been exploited to enable novel active and passive components in the submillimeter-wave region. We report on silicon micromachined methodologies that will enable large format submillimeter-wave heterodyne arrays and 3-D integration of the whole receiver front-end.
Keywords
batch processing (industrial); micromachining; nanofabrication; silicon; THz frequency; batch processing; compact integrated receiver; dimensional control; receiver front-end; silicon micromachined methodologies; silicon nanofabrication; submillimeter-wave heterodyne arrays; submillimeter-wave region; Instruments; Mixers; Optical transmitters; Optical waveguides; Receivers; Silicon; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on
Conference_Location
Houston, TX
ISSN
2162-2027
Print_ISBN
978-1-4577-0510-6
Electronic_ISBN
2162-2027
Type
conf
DOI
10.1109/irmmw-THz.2011.6104765
Filename
6104765
Link To Document