Title :
Package design and material impact on board level reliability of fine pitch packages
Author_Institution :
Amkor, Chandler, AZ, USA
Abstract :
Summary form only given: The reliability of an electronic package is ultimately determined by the environment and application in which it is used. Due to the proliferation of electronic devices across market segments ranging from automotive to small, hand-held devices, electronic packages experience different loading conditions and thus need to pass varying reliability requirements. The gradual migration to Pb free, RoHS, and green packaging in various sectors of the industry is further challenging the manufacturers of electronic packages to provide reliable solutions with diverse material sets.
Keywords :
circuit reliability; electronics packaging; board level reliability; electronic devices; electronics package; fine pitch packages; green packaging; hand-held devices; package design; Automotive engineering; Composite materials; Consumer electronics; Electronics industry; Electronics packaging; Industrial electronics; Manufacturing industries; Materials reliability; Surface finishing; Temperature;
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2009.5173242