Qualification issues and pitfalls for advanced semiconductor devices in space

Author

Sunderland, David A.

Author_Institution

Boeing Space & Intell. Syst., El Segundo, CA, USA

fYear

2009

fDate

26-30 April 2009

Firstpage

221

Lastpage

228

Abstract

Increasing satellite performance within size, weight and power constraints demands access to advanced semiconductors, yet environmental, reliability and schedule requirements remain. Successful technology insertion requires knowledge of failure mechanisms, design limitations and screening flow. We review Boeing´s approach, critical issues and potential pitfalls, illustrated by experience with IBM ASICs.

Keywords

application specific integrated circuits; failure analysis; radiation hardening (electronics); semiconductor device reliability; space vehicle electronics; Boeing´s approach; IBM ASIC; failure mechanism; radiation hardening; satellite performance; semiconductor device reliability; spacecraft electronics; Electronics packaging; Failure analysis; Integrated circuit packaging; Integrated circuit reliability; Integrated circuit technology; Power system reliability; Qualifications; Satellites; Semiconductor devices; Space technology; ASICs; integrated circuits; programmable devices; qualification; radiation effects; radiation hardening; reliability; spacecraft electronics; technology insertion;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 2009 IEEE International

Conference_Location

Montreal, QC

ISSN

1541-7026

Print_ISBN

978-1-4244-2888-5

Electronic_ISBN

1541-7026

Type

conf

DOI

10.1109/IRPS.2009.5173254

Filename

5173254