Title :
Thermomechanical reliability for emerging device technologies: Implications for ULK integration, 3-D structures and packaging
Author :
Dauskardt, Reinhold H.
Author_Institution :
Dept. of Mater. Sci. & Eng., Stanford Univ., Stanford, CA, USA
Abstract :
In this paper, the author describes research aimed at characterizing thin-film thermomechanical properties including adhesion and cohesion that are critical for emerging device technologies. The author considers particular challenges of integrating nanostructured materials like nanoporous ULK materials and heterojunction layers in photovoltaic devices. Manipulating the composition and molecular structure of ULK materials is shown to optimize thermomechanical properties. Special consideration was given on strategies to produce molecularly reinforced ULK materials based on established organosilicate technologies, and post-deposition UV and e-beam curing with carefully engineered adjacent barrier layers to further optimize properties.
Keywords :
adhesion; bonding processes; chemical mechanical polishing; curing; electronics packaging; low-k dielectric thin films; semiconductor device reliability; semiconductor technology; thermomechanical treatment; 3D structure; ULK integration; device technology; electron beam curing; electronics packaging; heterojunction layers; molecular structure; nanoporous ULK material; organosilicate technology; photovoltaic device; post deposition UV curing; thermomechanical reliability; thin film thermomechanical property; Adhesives; Composite materials; Heterojunctions; Nanoporous materials; Nanostructured materials; Packaging; Photovoltaic systems; Solar power generation; Thermomechanical processes; Thin film devices;
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2009.5173294
