Thermomechanical reliability for emerging device technologies: Implications for ULK integration, 3-D structures and packaging

In this paper, the author describes research aimed at characterizing thin-film thermomechanical properties including adhesion and cohesion that are critical for emerging device technologies. The author considers particular challenges of integrating nanostructured materials like nanoporous ULK materials and heterojunction layers in photovoltaic devices. Manipulating the composition and molecular structure of ULK materials is shown to optimize thermomechanical properties. Special consideration was given on strategies to produce molecularly reinforced ULK materials based on established organosilicate technologies, and post-deposition UV and e-beam curing with carefully engineered adjacent barrier layers to further optimize properties.