Title :
Millimeterwave Integrated Circuits
Author :
Komizo, H. ; Tokumitsu, Y.
Abstract :
This paper describes a compact, low cost 50 GHz-band integrated doppler radar module for an automobile ground speed sensor in which a copper embedded Fine Grained Alumina (FGA) substrate is successfully used for good heat-sinking and grounding. Results of an initial study on oscillator stabilization by a dielectric resonator in the millimeterwave region is also described.
Keywords :
Copper; Costs; Cutoff frequency; Dielectric substrates; Grounding; Microstrip; Oscillators; Rough surfaces; Submillimeter wave integrated circuits; Waveguide transitions;
Conference_Titel :
Microwave Symposium Digest, 1981 IEEE MTT-S International
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/MWSYM.1981.1129861
