DocumentCode
2672020
Title
The driver/receiver conflict problem in interconnect testing with boundary-scan
Author
Jin, London
Author_Institution
Vertex Semiconductor, San Jose, CA, USA
fYear
1993
fDate
16-18 Nov 1993
Firstpage
210
Lastpage
214
Abstract
This paper explores the driver/receiver conflict problem in interconnect testing with bidirectional pins and 3-state output pins in boundary-scan. The objective is to have a higher-level (higher than chip) designer be aware of this conflict. Some existing algorithms are reviewed
Keywords
boundary scan testing; design for testability; multichip modules; printed circuit accessories; MCM; PC interconnects; bidirectional pins; boundary-scan; driver/receiver conflict; interconnect testing; Driver circuits; Integrated circuit interconnections; Logic; Pins; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium, 1993., Proceedings of the Second Asian
Conference_Location
Beijing
Print_ISBN
0-8186-3930-X
Type
conf
DOI
10.1109/ATS.1993.398806
Filename
398806
Link To Document