Title :
Thermal smooth control based on orthogonal circulating current for multi-MW parallel wind power converter
Author :
Jianwen Zhang ; Yan Li ; Haisong Wang ; Xu Cai ; Igarashi, Seiki ; Zhibing Wang
Author_Institution :
Sch. of Electron., Inf. & Electr. Eng., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
Multi-MW wind power converters are widely applied in wind power field. Converters are paralleled to expand converter´s capacity. Due to the wind power fluctuation, IGBT´s power handling ability together with its drive power is fluctuating largely and rapidly, which will cause a large temperature variation, affecting the reliability and lifetime of power semiconductors. In this paper, the thermal smooth control for DC-BUS connected parallel wind power converter is proposed to improve the converter´s reliability. In the proposed thermal smooth control, orthogonal circulating current is introduced to smooth the thermal stresses of IGBTs. Therefore, a balanced thermal can improve IGBT´s reliability, which can improve the wind power converter´s reliability. Finally, MATLAB/PLECS simulation is carried out to validate the proposed thermal control. The simulation results indicate the feasibility and advantage of the proposed thermal smooth control.
Keywords :
insulated gate bipolar transistors; power convertors; power semiconductor devices; semiconductor device reliability; smoothing circuits; temperature control; thermal stresses; wind power plants; DC-BUS connected parallel wind power converter; IGBT; MATLAB/PLECS simulation; converter reliability; insulated gate bipolar transistor; multi-MW parallel wind power converter; orthogonal circulating current; power semiconductor; thermal smooth control; thermal stress; wind power fluctuation; Insulated gate bipolar transistors; Junctions; Power conversion; Reactive power; Reliability; Wind power generation; multi-MW wind power converter; orthogonal circulating current; parallel converter; thermal smooth;
Conference_Titel :
Electronics and Application Conference and Exposition (PEAC), 2014 International
Conference_Location :
Shanghai
DOI :
10.1109/PEAC.2014.7037844