DocumentCode :
2672191
Title :
Methodology to analyze failure mechanisms of ohmic contacts on MEMS switches
Author :
Broué, Adrien ; Dhennin, Jérémie ; Seguineau, Cédric ; Lafontan, Xavier ; Dieppedale, Christel ; Desmarres, Jean-Michel ; Pons, Patrick ; Plana, Robert
Author_Institution :
DCT/AQ/LE, NOVAMEMS, Toulouse, France
fYear :
2009
fDate :
26-30 April 2009
Firstpage :
869
Lastpage :
873
Abstract :
This paper demonstrates the efficiency of a new methodology using a commercial nanoindenter coupling with electrical measurement on test vehicles specially designed to investigate the micro contact reliability. This study examines the response of gold contacts with 5 mum2 square bumps under various levels of current flowing through contact asperities. Contact temperature rising is observed leading to shifts of the mechanical properties of contact material, modifications of the contact topology and a diminution of the time dependence creep effect. The data provides a better understanding of micro-scale contact physics especially failure mechanisms due to the heating of the contact on MEMS switches.
Keywords :
creep; failure analysis; gold; microswitches; nanoindentation; ohmic contacts; Au; MEMS switches; creep; electrical measurement; failure analysis; micro contact reliability; microelectromechanical system switches; nanoindenter coupling; ohmic contact; Couplings; Electric variables measurement; Failure analysis; Gold; Mechanical factors; Microswitches; Ohmic contacts; Temperature dependence; Testing; Vehicles; contact heating; electrical contacts; failure mechanisms; microelectromechanical systems (MEMS); switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
ISSN :
1541-7026
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2009.5173369
Filename :
5173369
Link To Document :
بازگشت