• DocumentCode
    2672219
  • Title

    Study of the charge-trapping characteristics of silicon-rich nitride thin films using the gate-sensing and channel-sensing (GSCS) method

  • Author

    Lu, Chi-Pin ; Hsieh, Jung-Yu ; Du, Pei-Ying ; Lue, Hang-Ting ; Yang, Ling-Wu ; Yang, Tahone ; Chen, Kuang-Chao ; Lu, Chih-Yuan

  • Author_Institution
    Technol. Dev. Center, Macronix Int. Co. Ltd., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    883
  • Lastpage
    886
  • Abstract
    The present study investigates the charge trapping characteristics of Si-rich nitride thin films in detail by using the gate-sensing and channel-sensing (GSCS) method. Analytical results indicate that thicker (>7 nm) nitride thin films are fully-capturing; the trapped electrons are distributed in the center of the nitride, and the charge centroid is independent of the N/Si ratio. However, thinner nitride layers have significantly lower capture efficiency. Using silicon-rich nitride can improve capture efficiency and make the nitride thickness more scalable. Si-rich nitride can enhance the electron de-trapping speed under -FN erase, while at the expense of worse data retention. These results indicate that Si-rich nitride introduce more dangling bonds that increase more trap sites as well as more shallower traps.
  • Keywords
    dangling bonds; dielectric thin films; electron traps; silicon compounds; SiN; channel-sensing method; charge trapping; dangling bonds; electron trap; gate-sensing method; shallow traps; thin films; Atomic measurements; Capacitors; Cleaning; Electron traps; Material storage; Optical films; SONOS devices; Semiconductor thin films; Silicon; Wavelength measurement; Capture Efficiency; Charge De-trapping; Charge Trapping Flash; Data Retention; Silicon-Rich Nitride;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173371
  • Filename
    5173371