The Effect of Advanced Material on Multi-chip Module Electrical Properties

The materials and fabrication techniques determine the electrical resistivity, thermal conductivity, thermal expansion coefficient, dielectric constant, loss tangent and mechanical strength of the different grades of technique. Technique such as Multi-chip module which is an assembly in more than one integrated circuit (IC) is bare mounted on a common substrate. Different materials which are used in Multi-chip Module (MCM) technology change many characteristics such attenuation, loss tangent and Dielectric constant. In this paper some of advanced material in MCM technology is analyzed to see the characteristic of module. The technological materials properties are analyzed from the suggested MCM concept. The paper also shows high frequency performance, dielectric constant and Dissipation factor of the material used.