• DocumentCode
    267271
  • Title

    An optimized layout with split bus capacitors in eGaN-based integrated DC-DC converter module

  • Author

    Wang Kangping ; Ma Huan ; Yang Xu ; Zeng Xiangjun ; Li Guoqing

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2014
  • fDate
    5-8 Nov. 2014
  • Firstpage
    446
  • Lastpage
    450
  • Abstract
    This paper carefully discusses the interaction between the bus capacitors and the parasitic inductances in an integrated DC-DC converter module. The design principles of the bus capacitors are presented and validated by simulation results. In addition, an optimized PCB layout with split bus capacitors is proposed for enhancement-mode Gallium-Nitride (eGaN) transistors based integrated DC-DC power converter module. The power loop inductance is about 0.2nH extracted by Maxwell 3D simulation, which is reduced by 50% than that of the reported best layout. The results are validated by a buck converter operating at input voltage of 12V, output voltage of 3.3V, output current of 8A, and switching frequency of 1MHz.
  • Keywords
    DC-DC power convertors; III-V semiconductors; high electron mobility transistors; inductance; monolithic integrated circuits; power capacitors; printed circuit layout; wide band gap semiconductors; GaN; Gallium Nitride high electron mobility transistors; Maxwell 3D simulation; PCB layout optimization; buck converter; current 8 A; eGaN-based integrated DC-DC converter module; enhancement-mode gallium nitride transistor; frequency 1 MHz; power loop inductance; split bus capacitor; switching frequency; voltage 12 V; voltage 3.3 V; Capacitance; Capacitors; Impedance; Inductance; Layout; Switches; Switching frequency; DC-DC power converter; Gallium Nitride; integrated module; layout; parasitic inductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and Application Conference and Exposition (PEAC), 2014 International
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/PEAC.2014.7037897
  • Filename
    7037897