Title :
1996 Proceedings 46th Electronic Components and Technology Conference
Abstract :
The following topics were dealt with: passive optical alignment; popcorn phenomenon and solutions; multichip modules; thermal-mechanical modeling and simulation; advanced assembly and test processes; high speed parallel optical links; encapsulants, molding compounds, and dielectric materials; electronic components; high-speed high-density connectors; multifiber interconnection; direct chip attach; conductive adhesives; high speed optical packaging; ball grid array packaging; electrical modeling and simulation; package fabrication and assembly technology; flip-chip technology; optoelectronic packaging; solders; package reliability; single chip packaging
Keywords :
electronic equipment manufacture; assembly technology; ball grid array packaging; conductive adhesives; dielectric materials; direct chip attach; electrical modeling; electrical simulation; electronic components; encapsulants; flip-chip technology; high speed optical packaging; high speed parallel optical links; high-speed high-density connectors; molding compounds; multichip modules; multifiber interconnection; optoelectronic packaging; package fabrication; package reliability; passive optical alignment; popcorn phenomenon; single chip packaging; solders; test processes; thermal-mechanical modeling; thermal-mechanical simulation;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.517366
