Soldering technology for optoelectronic packaging

Author

Tan, Qing ; Lee, Y.C.

Author_Institution

Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

26

Lastpage

36

Abstract

Soldering technology for optoelectronic packaging is reviewed by studying modules in four categories: solder assembly with no precision self-alignments, and self-aligned solder assembly with no, one or two mechanical stops. There have been at least 60 papers and 8 U.S. patents published between 1990 and 1995. In addition to die-attachments, soldering technology has been successfully demonstrated for precision alignments. However, some packaging issues may hamper the progress of its manufacturing insertion for wide applications. Four of the issues to be discussed are solder materials, fluxless reflow, design, and reliability. More studies on these issues are needed to support the advancement of optoelectronic packaging for low-cost, high-performance and high-reliability modules

Keywords

flip-chip devices; integrated circuit reliability; integrated optoelectronics; optical couplers; optical interconnections; packaging; reflow soldering; reviews; semiconductor device reliability; die-attachments; fluxless reflow; mechanical stops; optoelectronic packaging; reliability; self-aligned assembly; solder assembly; soldering technology; Acceleration; Assembly systems; Costs; Light emitting diodes; Manufacturing; Materials reliability; Mechanical engineering; Optical waveguides; Packaging; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517371

Filename

517371