Method for improvement of mechanical assembly quality of precise electrical contacts

In electronics and sensor mounting technology, the reliability and quality of the modules depends on electrical contacts. Technologically this is a process of mechanical assembly and soldering/welding. The quality of contact depends on applied process parameters and human factor in both production steps. In this paper we investigate influence of different process parameters over the assembly of precise small contacts in high temperature sensor. These influences are examined by applying SPC (statistical process control) and after that optimal process parameters are defined. Process capability is more than 1.67 (automotive processes must be with capability greater than 1.67). For continuous improvement of assembly process we apply FMEA (Failure mode and effect analysis). Results are compared with other methods for component assembly like SMT -Surface mount technology which is a standard for judgement of contact assembly process characteristics.