Experimental evaluation of moisture-induced failures of surface mount plastic packages

Author

Ilyas, Qazi S M ; Potter, Mark E.

Author_Institution

Bell Labs., Lucent Technol., USA

fYear

1996

fDate

28-31 May 1996

Firstpage

56

Lastpage

67

Abstract

Moisture induced failures of surface mount plastic electronic packages during solder reflow is investigated experimentally for various package designs and different levels of moisture. Testing was carried out in connection with the development of guidelines for experimental qualifications and reliability monitoring programs for Metal Oxide Semiconductor (MOS) Integrated Circuit (IC) in plastic packages. Based on the obtained data, we developed recommendations for the selection of the appropriate moisture preconditioning parameters. The recommendations can be helpful to engineers associated with handling and storage of plastic packages of IC devices in and out of dry bags, as well as to quality control specialists, factory personnel, and customers involved in the manufacturing of surface mount plastic packages

Keywords

moisture; MOS integrated circuits; dry bags; moisture preconditioning parameters; moisture-induced failures; package designs; quality control; reliability monitoring programs; solder reflow; surface mount plastic packages; Circuit testing; Electronics packaging; Guidelines; Integrated circuit testing; Moisture; Plastic integrated circuit packaging; Plastic packaging; Qualifications; Semiconductor device packaging; Semiconductor device testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517375

Filename

517375