Prevention of aluminum pad corrosion by UV/ozone cleaning

One of the methods to prevent the moisture concentration, which can promote the corrosion of aluminum is to remove the space around the aluminum bonding pad. In other words, the perfect adhesion without delamination between the integrated circuit chip and the molding compound would not allow the electrolyte formation, and the aluminum pad corrosion. UV/ozone cleaning of the chip was thought to be able to strengthen the chip-molding compound adhesion. In this work, the effectiveness of UV/ozone cleaning in the prevention of aluminum pad corrosion, and the relationship between the delamination and the corrosion were investigated