Title :
Applying of Stacked Microvias in Printed Circuit Board
Author :
Falinski, Wojciech ; Koziol, Grazyna
Author_Institution :
Tele & Radio Res. Inst., Warsaw
Abstract :
The move in electronic packaging is going to maximum miniaturisation of Printed Circuit Boards interconnections. The area that offers the greatest potential of increasing the density is using of interconnections between layers in the form of buried microvias and stacked blind microvias. Microvias are now an essential part of the PCB manufacturing process and have allowed a rapid reduction in the size and weight of PCB. The new challenges are stacked microvias, which can give the possibility to electrically connect more than two layers of the PCB.
Keywords :
electronics packaging; integrated circuit interconnections; printed circuit manufacture; printed circuits; PCB manufacture; buried microvias; electronic packaging; printed circuit boards interconnections; stacked blind microvias; stacked microvias; Assembly; Costs; Dielectric substrates; Integrated circuit interconnections; Laser noise; Manufacturing processes; Metallization; Optical materials; Printed circuits; Testing;
Conference_Titel :
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location :
St. Marienthal
Print_ISBN :
1-4244-0551-3
Electronic_ISBN :
1-4244-0551-3
DOI :
10.1109/ISSE.2006.365140
