• DocumentCode
    267346
  • Title

    An Efficiency Improved Active Power Decoupling Circuit with Minimized Implementation Cost

  • Author

    Yi Tang ; Blaabjerg, Frede

  • Author_Institution
    Dept. of Energy Technol., Aalborg Univ., Aalborg, Denmark
  • fYear
    2014
  • fDate
    5-8 Nov. 2014
  • Firstpage
    864
  • Lastpage
    869
  • Abstract
    Active power decoupling techniques are promising solutions for capacitance reduction in single-phase AC/DC or DC/AC systems. This paper proposes a novel circuit topology which can realize the power decoupling function without adding additional active switches into the circuit. Also, the proposed topology does not require additional passive component, e.g. inductors or film capacitors for ripple energy storage because this task can be accomplished by the dc-link capacitors themselves, and therefore its implementation cost can be minimized. Another unique feature of the proposed topology is that the current stress of power semiconductors can be reduced as compared to a conventional single-phase converter under high load operation. Therefore, the conversion efficiency can be improved and this is impossible for other existing active power decoupling circuits. The operational principle of the proposed circuit is discussed, and both simulation and experimental results are presented to show the effectiveness of the proposed circuit concept.
  • Keywords
    capacitance; capacitors; cost reduction; coupled circuits; energy storage; power convertors; power semiconductor devices; AC/DC system; DC-link capacitor; DC/AC system; active power decoupling circuit; active switch; capacitance reduction; conversion efficiency; current stress; energy storage; film capacitor; implementation cost minimization; passive component; power decoupling function; power semiconductor; single-phase converter; Capacitance; Capacitors; Films; Inductors; Stress; Switches; Voltage control; active power decoupling; capacitance reduction; current stress; dc-link capacitor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and Application Conference and Exposition (PEAC), 2014 International
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/PEAC.2014.7037972
  • Filename
    7037972