3-dimensional memory module

Demand has recently increased for high packaging density and memory capacity of memory modules for electronic equipment. Our new 3-Dimensional Memory (3DM) Module satisfies this demand. This module has almost the same size as single memory packages (TSOPs: 17.4×9.22×1.2 mm) currently being used, and a package density 4 times as large. Electrical performance is better than that of TSOPs because the length of its wires is about half that of TSOP´s wires. Moreover, the cost to fabricate this module is low. This paper reports the module´s characteristics and fabrication process. The design concept is that next-generation memory devices will be produced by casing current mass-produced memory devices