Title :
LEADOUT Training Course on Pb-free Soldering
Author :
Illyefalvi-Vitéz, Zsolt ; Mason, Simon ; Freitas, Marta
Abstract :
The electronics industry is in the transition to lead-free technology, and it is very important for all industrial performers, to keep pace with this process. Lead-free soldering has become a big issue because of environmental concerns. The application of lead-free soldering alloys requires new design, materials, process, inspection and rework considerations. A training course has been developed with five modules to cover the following topics, which are particularly important for small and medium size enterprises for their everyday practice: Module 1. Solder paste printing and stencil handling; Module 2. Reflow and wave soldering temperature profiling; Module 3. Lead-free plating finishes for boards and components; Module 4. Hand soldering and rework; Module 5. Solder joint visual inspection. The Web-based e-learning version of the course is accessible for registered members at the LEADOUT project Web site (www.leadoutproject.com). In the paper, the general requirements of solder joints, the soldering process and the temperature profile optimization procedure of reflow and wave soldering are presented.
Keywords :
educational courses; electronics industry; reflow soldering; training; wave soldering; LEADOUT training course; Pb-free soldering; electronics industry; hand soldering; lead-free plating finishing; lead-free soldering; reflow soldering temperature profiling; small-and-medium size enterprises; solder joint visual inspection; solder paste printing; stencil handling; wave soldering temperature profiling; Electronic learning; Electronics industry; Environmentally friendly manufacturing techniques; Industrial training; Inspection; Lead; Printing; Process design; Soldering; Temperature;
Conference_Titel :
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location :
St. Marienthal
Print_ISBN :
1-4244-0551-3
Electronic_ISBN :
1-4244-0551-3
DOI :
10.1109/ISSE.2006.365144