Title :
Laser Welding Process and Packaging for Magnetic Field Sensors
Author :
Nicolics, Johann ; Musiejovsky, Laszlo ; Mündlein, Martin ; Zehetner, Hans ; Steurer, J. ; Giouroudi, I. ; Hauser, Hans
Author_Institution :
Vienna Univ. of Technol., Vienna
Abstract :
A manufacturing process for the production of miniaturized magnetic field sensors based on the GMI-effect (giant magnetoimpedance) in a thin wire of an amorphous Fe78Si7B15 alloy connected to Cu wires by laser welding is described. Due to the strong inclination of the amorphous structure to recrystallization already at a temperature far below the melting point a thermally optimized welding process is decisive for the success of the manufacturing process. The thermal load in the GMIwire in terms of the temporal temperature distribution caused by the laser welding process has been studied using transient thermal simulation. The length of the wire ends in the vicinity of the welding points in which recrystallization is believed to destroy the GMI effect is estimated. The results show that the length of the remaining active part of the GMI wire can be controlled by the energy and duration of the laser pulse and to a certain extent by the thermal properties of the substrate material. This study should help to understand the influence of welding parameters on the sensitivity of the sensor. The results of the thermal investigation are discussed with respect to the sensitivity of our GMI-sensor prototypes obtained from magnetic field measurements.
Keywords :
boron alloys; electronics packaging; giant magnetoresistance; iron alloys; laser beam welding; magnetic sensors; silicon alloys; temperature distribution; Fe78Si7B15; GMI-effect; electronics packaging; giant magnetoimpedance; laser welding process; magnetic field measurements; magnetic field sensors; temperature distribution; thermal properties; Amorphous magnetic materials; Amorphous materials; Magnetic sensors; Manufacturing processes; Packaging; Production; Sensor phenomena and characterization; Thermal loading; Welding; Wire; GMI-wire; sapphire substrate; transient thermal simulation;
Conference_Titel :
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location :
St. Marienthal
Print_ISBN :
1-4244-0551-3
Electronic_ISBN :
1-4244-0551-3
DOI :
10.1109/ISSE.2006.365151