Polymer Thick Film Technology for Realization of Fine Line Structures on Different Substrates

Author

Detert, Markus ; Rebenklau, Lars ; Zerna, Thomas ; Wolter, Klaus-Jürgen

Author_Institution

Dresden Univ. of Technol., Dresden

fYear

2006

fDate

10-14 May 2006

Firstpage

495

Lastpage

500

Abstract

The polymer-thick-film-technology (PTF) is a potential solution for realizing interconnections on substrates under consideration of some special aspects. Such aspects are the production costs and environmental requirements. This paper will analyze the printable resolution of up-to-date PTF pastes, the conductivity and the reliability of the realized structures. Therefore the technological properties of the pastes applied on flexible and rigid substrates are analyzed. It is shown that it is possible to realize structures with lines widths <100 mum and vias with diameters <200 mum using PTF technology. Furthermore the development of new materials allows the screen printing of high conductivity structures.

Keywords

interconnections; polymer films; thick film devices; PTF pastes; environmental requirements; fine line structures; interconnections; polymer thick film technology; production costs; screen printing; Conducting materials; Conductivity; Conductors; Insulation; Manufacturing; Polymer films; Printing; Space technology; Substrates; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on

Conference_Location

St. Marienthal

Print_ISBN

1-4244-0551-3

Electronic_ISBN

1-4244-0551-3

Type

conf

DOI

10.1109/ISSE.2006.365156

Filename

4216086