• DocumentCode
    2673709
  • Title

    Simulation of contact effects in multiterminal thick-film and LTCC microresistors

  • Author

    Mis, Edward ; Dziedzic, Andrzej

  • Author_Institution
    Wroclaw Univ. of Technol., Wroclaw
  • fYear
    2006
  • fDate
    10-14 May 2006
  • Firstpage
    501
  • Lastpage
    505
  • Abstract
    Contact effects are present in thick-film resistors and cannot be neglected. Owing to complicated relation between component parameters and topology analytical approach is very difficult. Thus Finite Element Method was used. Sheet resistance distribution related to contact effects was modeled by placing in the resistor area intermediate layers along contacts. Geometrical factors, such as planar dimensions distribution and alignment of conductive and resistive layers was also examined. Promising agreement between simulation results and measured parameters was achieved.
  • Keywords
    ceramic packaging; contact resistance; finite element analysis; thick film resistors; LTCC microresistors; contact effects; finite element method; geometrical factors; multiterminal thick-film resistors; planar dimensions alignment; planar dimensions distribution; sheet resistance distribution; Conductive films; Conductivity; Contact resistance; Geometry; Immune system; Ink; Photonics; Resistors; Testing; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
  • Conference_Location
    St. Marienthal
  • Print_ISBN
    1-4244-0551-3
  • Electronic_ISBN
    1-4244-0551-3
  • Type

    conf

  • DOI
    10.1109/ISSE.2006.365157
  • Filename
    4216087