Title :
Simulation of contact effects in multiterminal thick-film and LTCC microresistors
Author :
Mis, Edward ; Dziedzic, Andrzej
Author_Institution :
Wroclaw Univ. of Technol., Wroclaw
Abstract :
Contact effects are present in thick-film resistors and cannot be neglected. Owing to complicated relation between component parameters and topology analytical approach is very difficult. Thus Finite Element Method was used. Sheet resistance distribution related to contact effects was modeled by placing in the resistor area intermediate layers along contacts. Geometrical factors, such as planar dimensions distribution and alignment of conductive and resistive layers was also examined. Promising agreement between simulation results and measured parameters was achieved.
Keywords :
ceramic packaging; contact resistance; finite element analysis; thick film resistors; LTCC microresistors; contact effects; finite element method; geometrical factors; multiterminal thick-film resistors; planar dimensions alignment; planar dimensions distribution; sheet resistance distribution; Conductive films; Conductivity; Contact resistance; Geometry; Immune system; Ink; Photonics; Resistors; Testing; Topology;
Conference_Titel :
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location :
St. Marienthal
Print_ISBN :
1-4244-0551-3
Electronic_ISBN :
1-4244-0551-3
DOI :
10.1109/ISSE.2006.365157