DocumentCode
2673724
Title
Heated microchamber made of LTCC
Author
Bembnowicz, Pawel ; Golonka, Leszek J. ; Malecha, Karol
Author_Institution
Wroclaw Univ. of Technol., Wroclaw
fYear
2006
fDate
10-14 May 2006
Firstpage
506
Lastpage
510
Abstract
This paper presents various methods of designing of heated microchamber based on LTCC (Low Temperature Co-fired Ceramics) and thick film technology. The temperature distribution inside the microchamber is modeled by thermal field simulation. The aim of the work is to obtain heated microchamber characterized by small thermal inertia and uniform distribution of temperature inside. Several various constructions of the chamber are presented.
Keywords
ceramic packaging; temperature distribution; thermal management (packaging); thick film devices; heated microchamber; low temperature cofired ceramics; temperature distribution; thick film technology; Ceramics; Dielectric losses; Lamination; Laser beam cutting; Manufacturing; Photonics; Shape; Temperature distribution; Temperature sensors; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location
St. Marienthal
Print_ISBN
1-4244-0551-3
Electronic_ISBN
1-4244-0551-3
Type
conf
DOI
10.1109/ISSE.2006.365158
Filename
4216088
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