Abstract :
The following topics were dealt with: failure analysis; reliability and quality; optoelectronics and optical interconnection technology; lifetime prediction in electronics; nondestructive testing; nanotechnology, nanomaterials and nanoelectronics; advanced packaging; system-on-chip; system-in-package; environmental issues; manufacturing technologies; quality management; printed circuit boards and substrates; manufacturing processes, process simulation and optimization; thin film and thick film techniques; sensors for NDE.
Keywords :
electronic equipment manufacture; electronics packaging; failure analysis; nanoelectronics; nanostructured materials; nanotechnology; nondestructive testing; optical interconnections; printed circuits; reliability; soldering; system-in-package; system-on-chip; thick film devices; thin film devices; electronics packaging; environmental issues; failure analysis; lifetime prediction; manufacturing processes; nanoelectronics; nanomaterials; nanotechnology; nondestructive testing; optical interconnection technology; optoelectronics; printed circuit boards; process simulation; quality management; reliability; system-in-package; system-on-chip; thick film techniques; thin film techniques;
Conference_Titel :
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location :
St. Marienthal
Print_ISBN :
1-4244-0550-5
DOI :
10.1109/ISSE.2006.365164
