DocumentCode :
2673814
Title :
Corrosion processes in the development of thin tarnish films
Author :
Payer, J.H.
Author_Institution :
Dept. of Mater. Sci. & Eng., Case Western Reserve Univ., Cleveland, OH, USA
fYear :
1990
fDate :
20-24 Aug 1990
Firstpage :
203
Lastpage :
211
Abstract :
Corrosion processes in thin films at the molecular level are investigated. Corrosion of thin films in two key areas is studied: (a) at the composition and structure of the thin-film corrosion layer; and (b) the processes of microcell corrosion that account for film growth from 2 nm to 20 nm. The electrochemical and chemical processes that occur in the development of thin tarnish layers and corrosion products during atmospheric exposures are discussed. The processes are illustrated by the behavior of copper in moist air containing low concentrations of sulfur dioxide. Corrosion science principles for bulk electrolytes are applied to the corrosion processes in thin films of electrolyte
Keywords :
corrosion testing; electrical contacts; 2 to 20 nm; atmospheric exposures; bulk electrolytes; chemical processes; electrochemical processes; microcell corrosion; moist air; molecular level; tarnish films; thin-film corrosion layer; Chemical processes; Connectors; Contacts; Copper; Corrosion; Iron; Life testing; Materials science and technology; Moisture; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts, 1990. Proceedings of the Thirty-Sixth IEEE Holm Conference on ... and the Fifteenth International Conference on Electrical Contacts
Conference_Location :
Montreal, Que.
Type :
conf
DOI :
10.1109/HOLM.1990.113014
Filename :
113014
Link To Document :
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