DocumentCode
2674028
Title
Observations of electrical contact surface in CuAg/Ni couple with make/break
Author
Honda, F. ; Imada, Y. ; Okumura, K. ; Nakajima, K.
Author_Institution
Toyota Technol. Inst., Nagoya, Japan
fYear
1990
fDate
20-24 Aug 1990
Firstpage
315
Lastpage
320
Abstract
A mechanism of erosion (wear) and material transfer occurring on electrical contact surfaces during make/break is investigated with Cu-Ag/Ni couples. It is found that the state of the contact surface depends largely on the duration of the anodic arc discharge and that the formation of a thin film of Cu2O on the surface plays an important role in controlling the erosion and material transfer to be generated on the contact surface. On the basis of the experimental results, a model for explaining the configurational and compositional change in electrical contact surface is proposed
Keywords
circuit-breaking arcs; copper alloys; electrical contacts; nickel; silver alloys; wear; CuAg-Ni; anodic arc discharge; compositional change; electrical contact surface; erosion; make/break; material transfer; wear; Arc discharges; Conducting materials; Contacts; Delamination; Oxidation; Shape memory alloys; Surface cracks; Surface discharges; Transistors; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 1990. Proceedings of the Thirty-Sixth IEEE Holm Conference on ... and the Fifteenth International Conference on Electrical Contacts
Conference_Location
Montreal, Que.
Type
conf
DOI
10.1109/HOLM.1990.113028
Filename
113028
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