• DocumentCode
    2674028
  • Title

    Observations of electrical contact surface in CuAg/Ni couple with make/break

  • Author

    Honda, F. ; Imada, Y. ; Okumura, K. ; Nakajima, K.

  • Author_Institution
    Toyota Technol. Inst., Nagoya, Japan
  • fYear
    1990
  • fDate
    20-24 Aug 1990
  • Firstpage
    315
  • Lastpage
    320
  • Abstract
    A mechanism of erosion (wear) and material transfer occurring on electrical contact surfaces during make/break is investigated with Cu-Ag/Ni couples. It is found that the state of the contact surface depends largely on the duration of the anodic arc discharge and that the formation of a thin film of Cu2O on the surface plays an important role in controlling the erosion and material transfer to be generated on the contact surface. On the basis of the experimental results, a model for explaining the configurational and compositional change in electrical contact surface is proposed
  • Keywords
    circuit-breaking arcs; copper alloys; electrical contacts; nickel; silver alloys; wear; CuAg-Ni; anodic arc discharge; compositional change; electrical contact surface; erosion; make/break; material transfer; wear; Arc discharges; Conducting materials; Contacts; Delamination; Oxidation; Shape memory alloys; Surface cracks; Surface discharges; Transistors; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1990. Proceedings of the Thirty-Sixth IEEE Holm Conference on ... and the Fifteenth International Conference on Electrical Contacts
  • Conference_Location
    Montreal, Que.
  • Type

    conf

  • DOI
    10.1109/HOLM.1990.113028
  • Filename
    113028