DocumentCode
2674242
Title
Terahertz testing of adhesive bonds
Author
Dürrschmidt, Stefan F. ; Wietzke, Steffen ; Jansen, Christian ; Wang, Haiyan ; Zhao, Guozhong ; Koch, Martin
Author_Institution
Dept. of Phys., Univ. Marburg, Marburg, Germany
fYear
2011
fDate
2-7 Oct. 2011
Firstpage
1
Lastpage
2
Abstract
So far, the strong demand for non-destructive testing of adhesive bonds has not sufficiently been met. Here, we demonstrate the capability of terahertz time-domain spectroscopy as a non-destructive technique for the analysis of adhesive layers in terms of thickness and dielectric properties by inspecting three different material systems.
Keywords
adhesive bonding; adhesives; inspection; nondestructive testing; terahertz spectroscopy; adhesive bonds; dielectric properties; inspection; nondestructive testing; terahertz time domain spectroscopy; Adhesives; Permittivity; Polymers; Spectroscopy; Testing; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on
Conference_Location
Houston, TX
ISSN
2162-2027
Print_ISBN
978-1-4577-0510-6
Electronic_ISBN
2162-2027
Type
conf
DOI
10.1109/irmmw-THz.2011.6105000
Filename
6105000
Link To Document