DocumentCode :
267435
Title :
Modeling and simulation of conducted EMI for front-end power supply
Author :
Qingbin Chen ; Yu Zhang ; Subin Lin ; Wei Chen
Author_Institution :
Coll. of Electr. Eng. & Autom., Fuzhou Univ., Fuzhou, China
fYear :
2014
fDate :
5-8 Nov. 2014
Firstpage :
1358
Lastpage :
1362
Abstract :
The conducted EMI simulation plays an important part in the SMPS in the product design. The analysis of common mode noise is much more complex than differential mode noise. The CE simulation accuracy depends on the accuracy of CM mode noise. CM noises are determined by the electric coupling between the voltage jump point and the ground. Traditional the CM models of the electric coupling between the primary and secondary windings of the transformer and between the magnetic components and the ground is got by tested with two-port equipment what are inconvenient for EMI simulation. In this paper the method by using FEA simulation method to get the electric coupling between the primary and secondary windings and the electric coupling between the magnetic components and the ground without test was proposed. Finally, the consistency between the experiment results and simulation results verify the proposed method to be correct and feasible. It provides a new idea for the modeling of the electric coupling for magnetic components.
Keywords :
earthing; electromagnetic interference; finite element analysis; switched mode power supplies; transformer windings; CE simulation accuracy; CM mode noise; FEA simulation method; SMPS; common mode noise; conducted EMI; conducted electromagnetic interference; differential mode noise; electric coupling; finite element analysis; front-end power supply; grounding; magnetic component; switched-mode power supply; transformer winding; two-port equipment; voltage jump point; Couplings; Electromagnetic interference; Inductors; Integrated circuit modeling; Mathematical model; Noise; Windings; conducted EMI; electric field coupling; model; simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and Application Conference and Exposition (PEAC), 2014 International
Conference_Location :
Shanghai
Type :
conf
DOI :
10.1109/PEAC.2014.7038061
Filename :
7038061
Link To Document :
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