DocumentCode
2674587
Title
Nondestructive inspection using pulsed terahertz wave
Author
Kim, Geun-Ju ; Kim, Jung-Il ; Jeon, Seok-Gy ; Kim, Jaehong
Author_Institution
Center for Pioneering Med.-Phys. Res., Korea Electrotechnol. Res. Inst., Ansan, South Korea
fYear
2011
fDate
2-7 Oct. 2011
Firstpage
1
Lastpage
2
Abstract
We suggest that THz wave is an alternative tool for the void detection in multilayer semiconductor. We measured the THz pulse using a reflective THz imaging system and obtained THz imaging by signal processing. And, to verify possibility of THz inspection, we compared with ultrasound.
Keywords
II-VI semiconductors; elemental semiconductors; multilayers; nondestructive testing; signal processing; terahertz wave imaging; voids (solid); wide band gap semiconductors; zinc compounds; Si; THz imaging; ZnTe; multilayer semiconductor; nondestructive inspection; pulsed terahertz wave; signal processing; void detection; Imaging; Inspection; Materials; Measurement by laser beam; Pulse measurements; Semiconductor device measurement; Ultrasonic imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on
Conference_Location
Houston, TX
ISSN
2162-2027
Print_ISBN
978-1-4577-0510-6
Electronic_ISBN
2162-2027
Type
conf
DOI
10.1109/irmmw-THz.2011.6105023
Filename
6105023
Link To Document