DocumentCode
26754
Title
Electrical properties of epoxy/POSS composites with homogeneous nanostructure
Author
Huang, Xumin ; Li, Yuhua ; Liu, Frank ; Jiang, Pingping ; Iizuka, Tetsuya ; Tatsumi, Kohei ; Tanaka, T.
Author_Institution
Department of Polymer Science and Engineering and Shanghai Key Lab of Electrical Insulation and Thermal Aging,Shanghai Jiao Tong University, Shanghai, China, 200240; State Key Lab of Power System, Tsinghua University, Beijing 100084, China
Volume
21
Issue
4
fYear
2014
fDate
Aug-14
Firstpage
1516
Lastpage
1528
Abstract
The knowledge of the structure-property relationship at nanoscale level is important to develop advanced dielectric polymer composites. Herein dielectric epoxy/polyhedral oligomeirc silsesquioxanes (POSS) composites with homogeneous nanostructure were prepared. Unlike the conventional inorganic nanoparticles (e.g., silica) used for polymer nanocomposite preparation, the POSS molecules used in this work have three advantages: a comparable size with the segments of polymer chains, being capable of reacting with the base polymer, good solubility in many solvents. These three advantages make the POSS be dispersed in polymers at a molecular level and thus their nano-effect could be fully utilized. Microstructure analysis by transmission electron microscopy, atomic force microscopy and X-ray diffraction confirmed the molecular-level dispersion of POSS in the epoxy composites. On this base, the partial discharge erosion resistance, frequency/temperature dependence of dielectric response, space charge distribution and breakdown strength of the epoxy/POSS composites were investigated. Moreover, the correlation between the nanostructure and properties of epoxy/POSS composites was documented.
Keywords
Dielectrics; Electric breakdown; Electrodes; Epoxy resins; Nanoparticles; Polymers; Temperature measurement; Nanocomposites; POSS; activation energy; breakdown strength.; dielectric constant; electrical conductivity; epoxy resin; nanostructure; space charge distribution;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2014.004314
Filename
6877978
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