Title :
A multifunctional laser linking and cutting structure for standard 0.25 μm CMOS-technology
Author :
Mende, Ole ; Redeker, Michael ; Rudack, Markus ; Treytnar, Dieter
Author_Institution :
Lab. for Inf. Technol., Hannover Univ., Germany
Abstract :
A novel laser-switch has been developed, designed and manufactured in a standard 6 level metal CMOS process. The redimensioned laser-switches combine a laser link and via (fuse) corresponding to minimum design rules in a single device. Due to vertical arrangement of the linking and the cutting structure (via), an area reduction of more than 30% is achieved, compared to laser arrays utilizing traditional laser structures. Simultaneous connecting and disconnecting reduces the processing time by 50%, since an additional process step is omitted. The resistance of the formed link structures is very low (R12×12median=0.065 Ω, R10×10median =0.118 Ω). Optimal values have been found for laser parameters to process the cutting structure with 100% yield. A first estimation of life-time results in t0.1=22 a. Arrangements of laser-switches for bus configuration and repair, and for overwriting static configuration signals are proposed
Keywords :
CMOS integrated circuits; cutting; integrated circuit interconnections; integrated circuit yield; joining processes; laser beam machining; maintenance engineering; 0.065 ohm; 0.118 ohm; 0.25 μm CMOS-technology; 0.25 mum; area reduction; bus configuration; cutting structure; fuse; laser-switch; multifunctional laser linking; overwriting; repair; simultaneous connecting disconnecting; vertical arrangement; CMOS process; Fuses; Integrated circuit yield; Joining processes; Laser beam cutting; Life estimation; Microelectronics; Optical design; Power lasers; Standards development;
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 2000. Proceedings. IEEE International Symposium on
Conference_Location :
Yamanashi
Print_ISBN :
0-7695-0719-0
DOI :
10.1109/DFTVS.2000.887149
