DocumentCode
2676753
Title
“BOND”: An interposition agents based fault injector for Windows NT
Author
Baldini, A. ; Benso, Alfredo ; Chiusano, Silvia ; Prinetto, Paolo
Author_Institution
Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
fYear
2000
fDate
2000
Firstpage
387
Lastpage
395
Abstract
The goal of this paper is to present BOND, a Software Fault Injection tool able to simulate abnormal behavior of a computer system running Windows NT 4.0 Operating System. The Fault Injector is based on interposition techniques, which guarantees a low impact on the execution of the target program, and allows the injection of Commercial off-the-Shelf software programs. BOND allows performing both statistical and deterministic fault injection experiments, trading-off between overhead and precision of the obtained results. Moreover, the tool is capable of injecting faults into different locations, at any level of the application context (code and data sections, stack, heap, processor´s registers, system calls, …). A complete set of experimental results on different application programs demonstrates the effectiveness and the flexibility of the tool
Keywords
operating systems (computers); software agents; software fault tolerance; BOND; Windows NT; application context; application programs; deterministic fault injection experiments; interposition agents based fault injector; statistical fault injection experiments; Application software; Bonding; Computational modeling; Computer errors; Computer simulation; Fault tolerant systems; Hardware; Operating systems; Registers; Software tools;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI Systems, 2000. Proceedings. IEEE International Symposium on
Conference_Location
Yamanashi
ISSN
1550-5774
Print_ISBN
0-7695-0719-0
Type
conf
DOI
10.1109/DFTVS.2000.887179
Filename
887179
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