• DocumentCode
    2676753
  • Title

    “BOND”: An interposition agents based fault injector for Windows NT

  • Author

    Baldini, A. ; Benso, Alfredo ; Chiusano, Silvia ; Prinetto, Paolo

  • Author_Institution
    Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    387
  • Lastpage
    395
  • Abstract
    The goal of this paper is to present BOND, a Software Fault Injection tool able to simulate abnormal behavior of a computer system running Windows NT 4.0 Operating System. The Fault Injector is based on interposition techniques, which guarantees a low impact on the execution of the target program, and allows the injection of Commercial off-the-Shelf software programs. BOND allows performing both statistical and deterministic fault injection experiments, trading-off between overhead and precision of the obtained results. Moreover, the tool is capable of injecting faults into different locations, at any level of the application context (code and data sections, stack, heap, processor´s registers, system calls, …). A complete set of experimental results on different application programs demonstrates the effectiveness and the flexibility of the tool
  • Keywords
    operating systems (computers); software agents; software fault tolerance; BOND; Windows NT; application context; application programs; deterministic fault injection experiments; interposition agents based fault injector; statistical fault injection experiments; Application software; Bonding; Computational modeling; Computer errors; Computer simulation; Fault tolerant systems; Hardware; Operating systems; Registers; Software tools;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Defect and Fault Tolerance in VLSI Systems, 2000. Proceedings. IEEE International Symposium on
  • Conference_Location
    Yamanashi
  • ISSN
    1550-5774
  • Print_ISBN
    0-7695-0719-0
  • Type

    conf

  • DOI
    10.1109/DFTVS.2000.887179
  • Filename
    887179