In-process board warpage measurement in a lab scale wave soldering oven

Author

Stiteler, Michael R. ; Ume, Charles ; Leutz, Brian

Author_Institution

Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

247

Lastpage

254

Abstract

An automated on-line warpage measurement system for printed wiring boards (PWBs) and printed wiring board assemblies (PWBAs) has been developed. The system is capable of simulating a variety of soldering processes, including the wave soldering process, and performing real-time PWB/PWBA warpage measurements using the shadow moire technique. The system can be used to characterize the warpage behaviour of virtually any PWB/PWBA during the soldering process. Using this system, warpage of PWB test vehicles was measured during simulated wave soldering. The measured warpage varied significantly during wave soldering from that observed both before and after wave soldering. These results help us to understand how the board deforms at every stage of the soldering process

Keywords

digital simulation; moire fringes; printed circuit manufacture; printed circuit testing; production testing; wave soldering; board deformation; board warpage measurement; lab scale wave soldering oven; printed wiring board assemblies; printed wiring boards; real-time measurements; shadow moire technique; Electronics packaging; Integrated circuit packaging; Lead; Manufacturing processes; Ovens; Performance evaluation; Soldering; Surface-mount technology; Very high speed integrated circuits; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517399

Filename

517399