Title :
Timewise increases in contact resistance due to surface roughness and corrosion
Author :
Bryant, Michael D. ; Jin, Moulin
Author_Institution :
Dept. of Mech. Eng., Texas Univ., Austin, TX, USA
Abstract :
To understand failure and estimate connector reliability a connector model was made in which two mated rough copper surfaces were subjected to ingression and corrosive attack by atmospheric oxygen. The rough surface segments the connector contact area into many small discrete areas (a-spots) through which currents flow. The initial a-spot contact radii ae (formed as metal-to-metal bridges by mating surface heights on the mating surfaces) was determined by the externally applied load, connector materials, geometry, and surface topography. Later, corrosive attack of the metallic surfaces cause the metallic contact radii to shrink and resistances to increase. Factors in the model that influence the corrosive process are environmental temperature, partial pressure of oxygen, and geometric factors associated with the contact. Resulting curves of contact resistance versus time are similar in trend and shape to experimentally measured curves by Takano and Mano. From time variations of contact resistance of the connector, methods for estimating the useful lifetime of electrical connectors are given
Keywords :
contact resistance; copper; corrosion; electric connectors; failure analysis; reliability; Cu-Cu; Cu2O film growth; connector contact area; connector model; connector reliability estimation; contact resistance versus time; corrosive attack; environmental temperature; geometric factors; surface corrosion; surface roughness; time variations of contact resistance; Atmospheric modeling; Bridges; Connectors; Contact resistance; Copper; Rough surfaces; Shape measurement; Surface resistance; Surface roughness; Surface topography;
Conference_Titel :
Electrical Contacts, 1990. Proceedings of the Thirty-Sixth IEEE Holm Conference on ... and the Fifteenth International Conference on Electrical Contacts
Conference_Location :
Montreal, Que.
DOI :
10.1109/HOLM.1990.113070