DocumentCode
2676875
Title
A Two-Tier Deembedding Technique for Packaged Transistors
Author
Vaitkus, R. ; Scheitlin, D.
fYear
1982
fDate
15-17 June 1982
Firstpage
328
Lastpage
330
Abstract
This paper describes a technique for deembedding transistor chip scattering parameters from the measurements of packaged devices in a standard transistor test fixture by the use of a set of secondary calibration standards, consisting of empty and specially wire-bonded transistor packages.
Keywords
Calibration; Circuits; Error analysis; Error correction; Fixtures; Measurement standards; Microwave transistors; Packaging; Scattering parameters; Semiconductor device measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1982 IEEE MTT-S International
Conference_Location
Dallas, TX, USA
ISSN
0149-645X
Type
conf
DOI
10.1109/MWSYM.1982.1130708
Filename
1130708
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