OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools

Author

Wong, Y.M. ; Muehlner, D.J. ; Faudskar, C.C. ; Fishteyn, M. ; Gates, J.V. ; Anthony, P.J. ; Cyr, G.J. ; Choi, J. ; Crow, J.D. ; Kuchta, D.M. ; Pepeljugoski, P.K. ; Stawiasz, Kevin ; Nation, W. ; Engebretsen, D. ; Whitlock, Brent ; Morgan, R.A. ; Hibbs-Bre

Author_Institution

Bell Labs., Lucent Technol., Murray Hill, NJ, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

269

Lastpage

278

Abstract

This paper discusses the present state of the art of components, systems, and application technology related to parallel optical data links (ODL) as demonstrated by the OptoElectronic Technology Consortium (OETC). Parallel ODL technology is poised for large volume commercialization despite some uncertainties in industrial standards and system applications. This is fueled by the demand for high-bandwidth to support the upcoming information age. To meet the need for low-cost, broadband digital multimedia services, parallel ODL technology faces the challenge of providing reasonable cost/performance ratios when compared with other established technologies. Responding to this challenge has required the integration of a number of state-of-the-art component technologies (e.g. VCSEL, monolithic integrated photoreceiver, MCM, GaAs IC, optical array connector and cable) with system designs and applications

Keywords

data communication; optical fibre communication; GaAs IC; MCM; OETC; OptoElectronic Technology Consortium; VCSEL; components; monolithic integrated photoreceiver; optical array connector; optical cable; parallel optical data link; simulation tools; system applications; Application specific integrated circuits; Commercialization; Costs; Gallium arsenide; Monolithic integrated circuits; Optical arrays; Optical devices; Photonic integrated circuits; Uncertainty; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517403

Filename

517403