DocumentCode
267781
Title
Dual-mode vertical membrane resonant pressure sensor
Author
Tabrizian, Roozbeh ; Ayazi, Farrokh
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
120
Lastpage
123
Abstract
This paper presents a novel dual-mode resonant pressure sensor operating based on mass loading of air molecules on transversely resonating vertical silicon membranes. Two silicon bulk acoustic resonators (SiBAR) are acoustically coupled through thin vertical membranes, resulting in two high-g resonance modes with small frequency split, but large difference in pressure sensitivity. The membranes are designed to couple 180° out-of-phase vibrations of piezoelectrically-transduced SiBARs through pressure-insensitive extensional Lamb waves and without changing their resonance frequency. The in-phase vibrations, on the other hand, induce a high-order pressure-sensitive transverse flexural resonance in vertical membranes while slightly changing the resonance frequency of SiBAR due to stiffness and mass loading. A combinatorial of the two modes is used as a pressure sensor with an amplified sensitivity. A proof-of-concept device implemented on a 20 μm silicon substrate and activated by a thin aluminum nitride film shows a combinatorial beat frequency (fb) of 1.3 MHz with a linear pressure sensitivity of 346 ppm/kPa over 0-100kPa range.
Keywords
acoustic resonators; aluminium; elemental semiconductors; membranes; piezoelectric transducers; pressure sensors; silicon; surface acoustic waves; Al; Lamb waves; Si; SiBAR; air molecules; dual-mode vertical membrane; flexural resonance; mass loading; phase vibrations; piezoelectric transducer; pressure 0 kPa to 100 kPa; pressure sensitivity; resonance frequency; resonance modes; resonant pressure sensor; silicon bulk acoustic resonators; silicon substrate; size 20 mum; thin aluminum nitride film; thin vertical membranes; vertical silicon membranes; Acoustics; Damping; Fluids; Loading; Resonant frequency; Sensitivity; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765588
Filename
6765588
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