Title :
Three dimensional packaging and interconnecting techniques for microwave modules
Author :
Wei, Yau ; Fang Xunlei ; Wei, Hong
Author_Institution :
Dept. of Radio Eng., Southeast Univ., Nanjing, China
fDate :
Oct. 28 2003-Nov. 1 2003
Abstract :
Three dimensional (3D) packaging and interconnecting techniques can greatly reduce the weight and volume of conventional planar microwave modules. The objective of this study was to employ a novel 3D structure with simple manufacturing process to develop 3D microwave modules. Many advanced 3D packaging and interconnecting methods, such as LTCC microwave multichip modules, vertical interconnects, and 3D electromagnetic field analyzing and optimizing, were applied to increase the package density and improve the electric performance. Test method and test results of 3D microwave modules were introduced. These techniques are very useful to many types of modern active phased array radar systems and communication systems.
Keywords :
ceramic packaging; integrated circuit manufacture; interconnections; microwave integrated circuits; multichip modules; 3D electromagnetic field analysis; 3D interconnecting techniques; communication systems; electric performance; microwave multichip modules; phased array radar systems; planar microwave modules; three dimensional packaging techniques; vertical interconnects; Electromagnetic analysis; Electromagnetic fields; Manufacturing processes; Microwave theory and techniques; Multichip modules; Optimization methods; Packaging; Performance analysis; Phased arrays; Testing;
Conference_Titel :
Antennas, Propagation and EM Theory, 2003. Proceedings. 2003 6th International SYmposium on
Conference_Location :
Beijing, China
Print_ISBN :
0-7803-7831-8
DOI :
10.1109/ISAPE.2003.1276819
