• DocumentCode
    2678090
  • Title

    Langasite surface acoustic wave sensors for high temperatures

  • Author

    Honal, M. ; Fachberge, R. ; Holzheu, T. ; Riha, E. ; Born, E. ; Pongratz, P. ; Bausewe, A.

  • Author_Institution
    Corp. Technol., Siemens AG, Germany
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    113
  • Lastpage
    118
  • Abstract
    Langasite (La3Ga5SiO14) has been used successfully as a piezoelectric substrate for surface acoustic wave (SAW) devices operating up to 1000°C. New investigations of material properties concerning the quality as well as the stability at high temperatures are presented. Apart from high temperature measurements on SAW devices and thermal analyses, optical absorption properties and the electric conductivity have been investigated. The crystal quality has been examined by various methods such as X-ray topography and chemical etching combined with optical microscopy for many LGS wafers from different growers
  • Keywords
    X-ray topography; absorption coefficients; crystal growth from melt; differential scanning calorimetry; etching; gallium compounds; high-temperature techniques; lanthanum compounds; mechanical birefringence; optical microscopy; piezoelectric materials; surface acoustic wave delay lines; surface acoustic wave sensors; surface conductivity; temperature measurement; thermal stability; 1000 C; CZ growth; DSC; La3Ga5SiO14; X-ray topography; chemical etching; high temperatures; langasite surface acoustic wave sensors; material quality; material stability; optical absorption properties; piezoelectric substrate; reflective delay lines; stress birefringence; surface conductivity; thermal analyses; thermal stability; Acoustic sensors; Acoustic waves; Optical microscopy; Optical sensors; Optical surface waves; Surface acoustic wave devices; Surface acoustic waves; Surface topography; Temperature sensors; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium and Exhibition, 2000. Proceedings of the 2000 IEEE/EIA International
  • Conference_Location
    Kansas City, MO
  • ISSN
    1075-6787
  • Print_ISBN
    0-7803-5838-4
  • Type

    conf

  • DOI
    10.1109/FREQ.2000.887339
  • Filename
    887339