Title :
BEST: Bond editor and test vector translator
Author :
Marimuthu, P. ; Raghunatharr, K.S.
Author_Institution :
Indian Telephone Industries Ltd., Bangalore, India
Abstract :
This paper describes a tool thuturiiomatically geizeru tes ATE compatible test program from CAD data for ASIC prototype evaluation. It crlso assists iri creating wire bond data required to assemble MICs in i-arious types ofpacliaps. This tool helps it1 achieving fast turn around time to generate ASIC test program for target ATE.
Keywords :
Assembly; Bonding; Data mining; Logic testing; Packaging; Predictive models; Signal generators; Space vector pulse width modulation; Timing;
Conference_Titel :
VLSI Design, 1993. Proceedings. The Sixth International Conference on
Conference_Location :
Bombay, India
Print_ISBN :
0-8186-3180-5
DOI :
10.1109/ICVD.1993.669656
