Title :
A high-throughput permeability assay platform for shear stress characterization of endothelial cells
Author :
Booth, Rupert ; Seungbeom Noh ; Hanseup Kim
Author_Institution :
USA Dept. of Electr. & Comput. Eng., Univ. of Utah, Salt Lake City, UT, USA
Abstract :
We characterized the first high-throughput permeability assay platform enabling compound permeability assays, at the full spectrum (1-60dyn/cm2) of shear stress, on endothelial cells. The platform comprises four parallel channels, with a porous membrane bonded between layers enabling permeability assays under four shear stresses per chip, ranging ~15x in magnitude. In the bEnd.3 brain endothelial cell line, decreased permeability was observed at rates of 4.06e-8 and 6.04e-8cm/s per unit shear stress (dyn/cm2) for FITC-Dextran and propidium iodide, respectively. Image analysis of cell stains indicated increased elongation and cell alignment with shear stress at rates of 9.15e-4 and 0.12° per dyn/cm2, respectively.
Keywords :
biomechanics; biomedical imaging; brain; cellular biophysics; elongation; lab-on-a-chip; permeability; FITC-dextran; brain endothelial cell line; elongation; high-throughput permeability assay platform; image analysis; parallel channels; porous membrane; propidium iodide; shear stress characterization; Arrays; Fluid flow measurement; Microfluidics; Permeability; Shape; Stress; Stress measurement;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location :
San Francisco, CA
DOI :
10.1109/MEMSYS.2014.6765619