• DocumentCode
    267839
  • Title

    3D solid-state supercapacitors obtained by ALD coating of high-density carbon nanotubes bundles

  • Author

    Fiorentino, G. ; Vollebregt, Sten ; Tichelaar, F.D. ; Ishihara, Ryoichi ; Sarro, P.M.

  • Author_Institution
    ECTM-DIMES, Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    342
  • Lastpage
    345
  • Abstract
    A three-dimensional solid-state miniaturized supercapacitor based on double conformal coating of Multiwalled Carbon Nanotubes (MWCNTs) bundles is presented. Atomic Layer Deposition (ALD) is used to deposit Al2O3 as dielectric layer and TiN as high aspect-ratio conformal counter-electrode on 2μm long MWCNTs bundles. The devices are realized using an IC wafer-scale manufacturing process and show a remarkable volumetric capacitance density value of 12mF/cm3 with high reproducibility (≤0.3E-12F deviation). The small footprint (100μm2 to 625μm2), a thickness of only 2μm, the extremely high capacitance density and the novel and easy-to-integrate fabrication process make it possible to realize high performance energy storage micro-devices.
  • Keywords
    atomic layer deposition; carbon nanotubes; supercapacitors; 3D solid-state supercapacitors; ALD coating; IC wafer-scale manufacturing process; MWCNT bundles; atomic layer deposition; dielectric layer; double-conformal coating; easy-to-integrate fabrication process; high-aspect ratio conformal counter-electrode; high-density carbon nanotube bundles; high-performance energy storage microdevices; multiwalled carbon nanotube bundles; size 2 mum; three-dimensional solid-state miniaturized supercapacitor; volumetric capacitance density value; Aluminum oxide; Capacitance; Coatings; Electrodes; Supercapacitors; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765646
  • Filename
    6765646