DocumentCode
267904
Title
Direct measurement of shear piezoresistance coefficient on single crystal silicon nanowire by asymmetrical four-point bending test
Author
Kimura, Tomohiro ; Saito, Nobuo ; Takeshita, Takaharu ; Sugano, K. ; Isono, Y.
Author_Institution
Grad. Sch. of Eng., Kobe Univ., Kobe, Japan
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
600
Lastpage
603
Abstract
This research evaluated the shear piezoresistance property of p-type single crystal silicon nanowire (SiNW) by the asymmetrical four-point bending (AFPB) technique proposed by the authors [1]. We fabricated the p-type SiNW on the AFPB test specimen with “V”-shaped notches (V-notches) made of single crystal silicon. Bending the specimen by the asymmetrical four point-supports, simple shear stress can be produced at the center of the specimen. Consequently, we have succeeded in evaluating the shear piezoresistance coefficient of SiNW directly, which was found to be π44=203 × 10-11 Pa-1 at an impurity concentration of 7.3 × 1018 cm-3. This value is 2.1 times larger than that of p-type piezoresistors used in conventional piezoresistance sensors on a micrometer scale. The proposed evaluation technique and obtained result will be effective for design application of high-sensitivity mechanical sensors integrating SiNW piezoresistance elements.
Keywords
bending; elemental semiconductors; impurity distribution; nanowires; piezoresistance; silicon; Si; V-shaped notches; asymmetrical four-point bending test; direct measurement; high-sensitivity mechanical sensors; impurity concentration; p-type single crystal silicon nanowire; piezoresistance elements; shear piezoresistance coefficient; shear stress; Crystals; Finite element analysis; Loading; Piezoresistance; Silicon; Stress; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765712
Filename
6765712
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