Title :
A CMOS MEMS Pirani vacuum gauge with complementary bump heat sink and cavity heater
Author :
Yi-Chiang Sun ; Kai-Chih Liang ; Chao-Lin Cheng ; Weileun Fang
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
A novel CMOS-MEMS Pirani vacuum gauge with complementary bump heat-sink and cavity heater design has been proposed and demonstrated. This design using CMOS-MEMS process to offer the following advantages for Pirani gauge: (1) The bump heat-sink vertical integrates with cavity heater increases the dynamic range and sensitivity without changing device footprint size, (2) The cavity in heater reduces the thermal mass for low-power operation, and (3) Easy integration with packaged CMOS-MEMS devices for pressure monitoring [1]. The design is implemented using the standard TSMC 0.18μm 1P6M CMOS process. A 120μm×120μm die size with 0.53μm sensing gap is demonstrated. Measurement indicates the gauge has sensing range 0.3-100torr with sensitivity of 1.53×104(K/W)/torr. The power consumption is 67μW for 1% resistance change. In comparison, the gauge with typical heat-sink/heater design has sensing range 1-100torr with sensitivity of 0.99×104(K/W)/torr and power consumption of 119μW.
Keywords :
CMOS integrated circuits; heat sinks; low-power electronics; micromechanical devices; vacuum gauges; CMOS MEMS Pirani vacuum gauge; CMOS-MEMS process; TSMC 1P6M CMOS process; cavity heater; complementary bump heat sink; device footprint size; dynamic range; low power operation; power 119 muW; power 67 muW; pressure monitoring; sensing gap; size 0.18 mum; size 0.53 mum; size 120 mum; thermal mass; Cavity resonators; Dynamic range; Heat sinks; Resistance heating; Sensitivity; Temperature measurement;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location :
San Francisco, CA
DOI :
10.1109/MEMSYS.2014.6765731
