Title :
An interconnection network for a novel reconfigurable circuit board
Author :
Norman, Richard ; Lepercq, Etienne ; Blaquière, Yves ; Valorge, Olivier ; Basile-Bellavance, Yan ; Prytula, Richard ; Savaria, Yvon
Author_Institution :
GR2M, Ecole Polytech. de Montreal, Montreal, QC
Abstract :
This paper presents a programmable interconnection network for a novel multi-reticle integrated circuit providing a reconfigurable circuit board for rapid system prototyping. This multi-dimensional mesh grid network, called WaferNettrade, can actively interconnect any pair of pins of integrated circuits deposited on the configurable system board. Two crossbar architectures are implemented and compared, one based on crosspoints and one based on standard cell multiplexers. Implementation results show the feasibility of this proposed cell-based array network that could interconnect a very large number of nodes, spread over an area that could fill a whole wafer, using a typical 6-metal 0.18 mum CMOS technology.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; printed circuits; prototypes; CMOS technology; WaferNet; cell-based array network; multidimensional mesh grid network; multireticle integrated circuit; programmable interconnection network; rapid system prototyping; reconfigurable circuit board; size 0.18 mum; CMOS technology; Contacts; Costs; Integrated circuit interconnections; Integrated circuit technology; Multiprocessor interconnection networks; Pins; Printed circuits; Prototypes; Sea surface;
Conference_Titel :
Circuits and Systems and TAISA Conference, 2008. NEWCAS-TAISA 2008. 2008 Joint 6th International IEEE Northeast Workshop on
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2331-6
Electronic_ISBN :
978-1-4244-2332-3
DOI :
10.1109/NEWCAS.2008.4606338