• DocumentCode
    267975
  • Title

    Ultrasound-assited micro-knife for cellular scale surgery

  • Author

    Hwapyeong Jeong ; Li, Tong ; Gianchandani, Yogesh B. ; Jaesung Park

  • Author_Institution
    Pohang Univ. of Sci. & Technol., Pohang, South Korea
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    885
  • Lastpage
    888
  • Abstract
    An ultrasound-assisted micro-knife with a 500nm-thick silicon nitride blade is described. The sharp blade can be operated to cut soft cells without lysing. The operation conditions are optimized by finite element analysis and experimental evaluation. For validation of the cutting precision SixNy blades without and with ultrasonic actuation are compared to a commercial scalpel. The commercial scalpel causes lysing of hepatocytes in a mono-layer; the SixNy blade without ultrasonic actuation cut these cells with a ragged cut line; the SixNy blade with 1 Vpp and 70.1kHz ultrasonic actuation cuts these cleanly, as narrow as 2 μm. Due to the controlled ultrasonic mode shape, the high operating frequency, and low applied power (1Vpp), the micro-knife performs highly precise dissection at the cellular scale without the need for high compressive force on the target cell. The SixNy blade with harmonic actuation has potential applications as a tool for minimally invasive surgery.
  • Keywords
    cellular biophysics; finite element analysis; silicon compounds; surgery; ultrasonic therapy; SixNy; cellular scale surgery; commercial scalpel; controlled ultrasonic mode shape; cutting precision; finite element analysis; frequency 70.1 kHz; harmonic actuation; hepatocytes; high operating frequency; highly precise dissection; low applied power; lysis; minimally invasive surgery; silicon nitride blade; size 500 nm; ultrasonic actuation; ultrasound-assited microknife; Acoustics; Blades; Fluorescence; Liquids; Resonant frequency; Silicon; Surgery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765783
  • Filename
    6765783