DocumentCode

2679863

Title

High aspect ratio quarter-micron electroless copper integrated technology

Author

Shacham-Diamand, Y. ; Lopatin, S.Y.

Author_Institution

Cornell University

fYear

1997

fDate

16-19 March 1997

Firstpage

11

Lastpage

14

Keywords

Chemical technology; Chemical vapor deposition; Conductivity; Copper; Metallization; Protection; Temperature; Tin; Transistors; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

conf

DOI

10.1109/MAM.1998.887494

Filename

887494